FEATURES:
Rapid heating, only 10s to reach 250℃
Built-in temperature sensor, stable output temperature.
Cool or hot air can be selected to preheat or cool chips.
The preheater can be used with rework stations to process BGA or other flake ICs. Specifications Power 460 W Temperature range 120℃.-250℃ Air volume 0.18m3 /min Dimensions 100(L)*60(W)*170(H)mm Weight About 1.0kg (including power cord)